US 12,014,967 B2
Manufacturing method of electronic package comprising a wire within an electronic component
Ho-Chuan Lin, Taichung (TW); Min-Han Chuang, Taichung (TW); and Chia-Chu Lai, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Jun. 27, 2023, as Appl. No. 18/215,113.
Application 18/215,113 is a division of application No. 17/368,475, filed on Jul. 6, 2021, granted, now 11,728,234.
Claims priority of application No. 110116024 (TW), filed on May 4, 2021.
Prior Publication US 2023/0343665 A1, Oct. 26, 2023
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01)
CPC H01L 23/3107 (2013.01) [H01L 21/56 (2013.01); H01L 23/5286 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method of manufacturing an electronic package, comprising:
providing a first electronic component including at least one conductive layer on a surface of the first electronic component, wherein the first electronic component includes an active surface and a non-active surface opposite to the active surface and side surfaces adjacent to the active surface and the non-active surface, wherein at least one electrode pad is disposed on the active surface, and at least one wire electrically connected with the at least one electrode pad, and is provided inside the first electronic component, such that the at least one conductive layer is electrically connected with the at least one wire, and the at least one conductive layer is free from being formed on the at least one electrode pad; and
embedding the first electronic component along with the at least one conductive layer in an encapsulant.