US 12,014,946 B2
Electrostatic chuck, vacuum processing apparatus, and substrate processing method
Genji Sakata, Chigasaki (JP); and Hidekazu Yokoo, Chigasaki (JP)
Assigned to ULVAC, INC., Chigasaki (JP)
Appl. No. 17/270,742
Filed by ULVAC, INC., Chigasaki (JP)
PCT Filed Aug. 8, 2019, PCT No. PCT/JP2019/031443
§ 371(c)(1), (2) Date Feb. 23, 2021,
PCT Pub. No. WO2020/115952, PCT Pub. Date Jun. 11, 2020.
Claims priority of application No. 2018-228266 (JP), filed on Dec. 5, 2018.
Prior Publication US 2021/0296154 A1, Sep. 23, 2021
Int. Cl. C23C 16/50 (2006.01); C23C 14/48 (2006.01); C23C 14/50 (2006.01); H01L 21/683 (2006.01); H01L 21/265 (2006.01)
CPC H01L 21/6833 (2013.01) [C23C 14/48 (2013.01); C23C 14/50 (2013.01); H01L 21/265 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An electrostatic chuck, comprising:
a chuck plate that has a first surface supporting a substrate and a second surface opposite to the first surface, and includes an exhaust passage that exhausts a gas emitted from the substrate from between the substrate and the first surface when the substrate is supported by the first surface,
wherein the chuck plate is an elastic member,
wherein the first surface is provided with a plurality of convex portions and an annular convex portion that surrounds the plurality of convex portions,
wherein a height h0 of the plurality of convex portions from the first surface is less than or equal to a height of the annular convex portion, and
wherein the height h0 of the plurality of convex portions from the first surface is capable of being adjusted to a height h1 lower than the height h0 by electrostatically adsorbing the substrate to the first surface when the substrate is placed on the first surface provided with the plurality of convex portions.