US 12,014,937 B2
Wafer treatment device
Bum Je Woo, Seongnam (KR)
Assigned to PICO & TERA CO., LTD., Suwon (KR)
Filed by PICO & TERA CO., LTD., Suwon (KR)
Filed on Apr. 21, 2022, as Appl. No. 17/726,445.
Application 17/726,445 is a continuation of application No. 14/760,345, granted, now 11,342,200, previously published as PCT/KR2013/009800, filed on Oct. 31, 2013.
Claims priority of application No. 10-2013-0003948 (KR), filed on Jan. 14, 2013.
Prior Publication US 2022/0246449 A1, Aug. 4, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); F24F 7/007 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/67028 (2013.01) [F24F 7/007 (2013.01); H01L 21/67017 (2013.01); H01L 21/67389 (2013.01); H01L 21/67393 (2013.01); H01L 21/67781 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A wafer treatment device, comprising:
a wafer cassette;
a first cleaning device provided in the wafer cassette to support a first wafer; and
a second cleaning device stacked on the first cleaning device to support a second wafer,
wherein the first cleaning device and the second cleaning device are arranged in a vertical direction in the wafer cassette,
wherein the first cleaning device comprises: a first purge gas inlet hole; and
a plurality of first injection holes connected with the first purge gas inlet hole,
wherein the second cleaning device comprises: a second purge gas inlet hole; and a plurality of second injection holes connected with the second purge gas inlet hole,
wherein the first purge gas inlet hole is connected to a corresponding first emission hole of an air pressure block emitting a purge gas,
wherein the second purge gas inlet hole is connected to a corresponding second emission hole of the air pressure block emitting the purge gas,
wherein the purge gas supplied through the first emission hole of the air pressure block is only emitted into the wafer cassette through the first injection holes, and the purge gas supplied through the second emission hole of the air pressure block is only emitted into the wafer cassette through the second injection holes,
wherein each emission hole of the air pressure block can be selectively opened and closed independent of the other emission holes, and
wherein the emission holes of the air pressure block supply the purge gas to the corresponding purge gas inlet holes.