US 12,014,906 B2
High temperature detachable very high frequency (VHF) electrostatic chuck (ESC) for PVD chamber
William R. Johanson, Gilroy, CA (US); Keith A. Miller, Mountain View, CA (US); Cheng-Hsiung Matthew Tsai, Cupertino, CA (US); John C. Forster, Mountain View, CA (US); and Mukund Sundararajan, Bangalore (IN)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Nov. 19, 2021, as Appl. No. 17/530,809.
Prior Publication US 2023/0162954 A1, May 25, 2023
Int. Cl. H01J 37/32 (2006.01); H01J 37/34 (2006.01)
CPC H01J 37/32724 (2013.01) [H01J 37/32082 (2013.01); H01J 37/34 (2013.01); H01J 2237/002 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/332 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate support for use in a substrate processing chamber, comprising:
an upper assembly having a base plate assembly coupled to a lower surface of a cooling plate, wherein the base plate assembly includes a plurality of electrical feedthroughs, and wherein the cooling plate includes a plurality of openings aligned with the plurality of electrical feedthroughs;
an electrostatic chuck disposed on the upper assembly and removably coupled to the cooling plate, wherein the electrostatic chuck has a chucking electrode disposed therein that is electrically coupled to a first pair of electrical feedthroughs of the plurality of electrical feedthroughs; and
an inner tube coupled to the cooling plate and configured to provide an RF delivery path to the electrostatic chuck via at least one of: a gap between the electrostatic chuck and the cooling plate, or backside metallization of the electrostatic chuck;
wherein at least one of:
the electrostatic chuck is coupled to the cooling plate at a central region of the electrostatic chuck such that a lower surface of the electrostatic chuck is spaced from an upper surface of the cooling plate, or
further comprising an outer tube disposed about the inner tube, and a lower assembly having a ceramic block disposed on a housing, wherein the outer tube is coupled to the housing to provide an RF return path, and wherein the ceramic block is disposed between the housing and the cooling plate to isolate the RF delivery path from the RF return path, or
the electrostatic chuck has an interface ring extending from a lower surface of the electrostatic chuck, wherein the interface ring includes a central through hole that is fluidly coupled to an opening in the cooling plate and configured to flow backside gas therethrough, or
a thermocouple is disposed through a central protrusion of the cooling plate and extends into the electrostatic chuck, or
further comprising a flexible connector that includes an opening at a first end to receive a terminal extending from a lower surface of the electrostatic chuck and an opening at a second end to receive a conductive core of one of the plurality of electrical feedthroughs, or
wherein a lower surface of the cooling plate includes a central protrusion and a coolant channel disposed about the central protrusion.