US 12,014,883 B2
Tantalum capacitor including conductive polymer layer having a filler
Yong Hyun Lee, Suwon-si (KR); Jin Ho Hong, Suwon-si (KR); Hyun Sub Oh, Suwon-si (KR); Youn Soo Kim, Suwon-si (KR); Jae Bum Cho, Suwon-si (KR); and Hee Sung Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jun. 7, 2022, as Appl. No. 17/834,277.
Claims priority of application No. 10-2021-0145574 (KR), filed on Oct. 28, 2021.
Prior Publication US 2023/0140133 A1, May 4, 2023
Int. Cl. H01G 9/028 (2006.01); H01G 9/025 (2006.01); H01G 9/042 (2006.01); H01G 9/15 (2006.01)
CPC H01G 9/025 (2013.01) [H01G 9/028 (2013.01); H01G 9/042 (2013.01); H01G 9/15 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A tantalum capacitor comprising:
a tantalum body comprising
a sintered tantalum body including tantalum particle,
a conductive polymer layer disposed on the sintered tantalum body and including a first filler, and
a tantalum wire penetrating through at least a portion of each of the sintered tantalum body and the conductive polymer layer in a first direction,
wherein a ratio of an area of the first filler to an area of the conductive polymer layer is greater than 0.38 in a first cross-section partially overlapping the sintered tantalum body, among cross-sections perpendicular to the first direction.