US 12,014,878 B2
Conductive paste including metal portions having different melting points and multilayer ceramic component using the same
Chung Hyeon Ryu, Suwon-si (KR); Hyo Kyong Seo, Suwon-si (KR); Jun Ho Yun, Suwon-si (KR); Ye Ji Hwang, Suwon-si (KR); and Seung Been Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 17, 2021, as Appl. No. 17/528,575.
Claims priority of application No. 10-2021-0110100 (KR), filed on Aug. 20, 2021.
Prior Publication US 2023/0055918 A1, Feb. 23, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A conductive paste, comprising:
a glass;
a plurality of cores comprising a first metal; and
a plurality of shells comprising a second metal having a melting point higher than that of the first metal, and respectively enclosing surfaces of the plurality of cores,
wherein adjacent shells, among the plurality of shells, directly contact each other such that adjacent cores, among the plurality of cores, are spaced apart from each other, and
wherein at least one shell, among the plurality of shells other than the adjacent shells, directly contacts one of the adjacent shells.