US 12,013,374 B2
Break strength method for testing glass laser cut quality of disc substrates using break testing apparatus
Anand Venkatesh Sethuraman, Fremont, CA (US); Xinwei Li, Fremont, CA (US); Emil John C. Esmenda, San Jose, CA (US); Qui Tan, Hayward, CA (US); Ray Lilly, San Jose, CA (US); Koji Adachi, San Ramon, CA (US); and Connor James Freeman, Long Beach, CA (US)
Assigned to SEAGATE TECHNOLOGY LLC, Fremont, CA (US)
Filed by Seagate Technology LLC, Fremont, CA (US)
Filed on Jul. 20, 2021, as Appl. No. 17/380,414.
Prior Publication US 2023/0021846 A1, Jan. 26, 2023
Int. Cl. G01N 3/02 (2006.01); G01N 3/08 (2006.01); G01N 3/20 (2006.01); G01N 3/30 (2006.01); G01N 33/38 (2006.01)
CPC G01N 3/02 (2013.01) [G01N 3/30 (2013.01); G01N 33/386 (2013.01); G01N 2203/0062 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
forming a first laser-cut line in a first glass sample with a first laser beam supplied by a laser cutting system when the laser cutting system is at a first process setting;
forming a second laser-cut line in a second glass sample with a second laser beam supplied by the laser cutting system when the laser cutting system is at a second process setting;
subjecting the first glass sample with the first laser-cut line to a first break test, and obtaining a first break strength value;
subjecting the second glass sample with the second laser-cut line to a second break test, and obtaining a second break strength value; and
identifying one of the first process setting or the second process setting as a preferred process setting for the laser cutting system based on a comparison of the first and second break strength values.