US 12,013,293 B2
Systems and methods for temperature measurements
Manuel Hortensia L Meyers, Leuven (BE)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Mar. 24, 2022, as Appl. No. 17/656,288.
Prior Publication US 2023/0304870 A1, Sep. 28, 2023
Int. Cl. G01K 7/16 (2006.01); G01K 7/22 (2006.01); G01K 7/24 (2006.01)
CPC G01K 7/223 (2013.01) [G01K 7/24 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An integrated circuit, comprising:
an analog stage including:
a connection to an external temperature-dependent resistor,
a pull-up resistor connected to the external temperature-dependent resistor in a voltage divider circuit, the pull-up resistor having an as-fabricated resistance value, the pull-up resistor including a plurality of resistor segments, and
a multiplexer configured to select at least one of the plurality of resistor segments having a resistance value to match a target resistance value for the pull-up resistor; and
a digital stage coupled to the analog stage by an analog-to-digital convertor (ADC), the ADC configured to digitize a voltage on the external temperature-dependent resistor and a voltage for the selected resistor segment having the resistance value for processing in the digital stage.