US 12,013,284 B2
Optical sensor module and packaging method thereof
Yu-Min Lin, Hsinchu County (TW); and Feng-Jung Hsu, Hsinchu County (TW)
Assigned to Sensortek Technology Corp., Zhubei (TW)
Filed by SENSORTEK TECHNOLOGY CORP., Hsinchu County (TW)
Filed on Dec. 16, 2022, as Appl. No. 18/067,066.
Claims priority of provisional application 63/265,504, filed on Dec. 16, 2021.
Prior Publication US 2023/0228619 A1, Jul. 20, 2023
Int. Cl. G01J 1/02 (2006.01); G01J 1/04 (2006.01)
CPC G01J 1/0271 (2013.01) [G01J 1/0459 (2013.01); G01J 2001/0276 (2013.01); G01J 1/0474 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An optical sensor module, comprising:
a substrate, including a light-sensing device and a light-emitting device; and
a housing, made of a transparent material, connected to said substrate and covering said light-sensing device;
wherein said housing includes a light-receiving region facing said light-sensing device; and said housing includes a shading coating layer on the inner surface of said housing facing said substrate and outside said light-receiving region;
wherein said housing includes a light-emitting region facing said light-emitting device; and said shading coating layer is disposed on the said inner surface of said housing facing said substrate and outside said light-receiving region and said light-emitting region;
wherein said housing includes a rib part protruding toward said substrate; said rib part is located between said light-sensing device and said light-emitting device, and said shading coating layer is disposed on a surface of said rib part facing said light-sensing device or a surface of said rib part facing light-emitting device.