US 12,013,282 B2
Techniques for alternate pressure equalization of a sensor
Jeremy Parker, Chelmsford, MA (US); and Kieran Harney, Andover, MA (US)
Assigned to INVENSENSE, INC., San Jose, CA (US)
Filed by INVENSENSE, INC., San Jose, CA (US)
Filed on Aug. 10, 2022, as Appl. No. 17/818,820.
Application 17/818,820 is a continuation of application No. 16/543,286, filed on Aug. 16, 2019, granted, now 11,467,025.
Claims priority of provisional application 62/765,083, filed on Aug. 17, 2018.
Prior Publication US 2022/0381605 A1, Dec. 1, 2022
Int. Cl. G01H 3/00 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01); G01H 11/06 (2006.01); H04R 19/00 (2006.01); H04R 31/00 (2006.01)
CPC G01H 3/00 (2013.01) [B81B 3/0018 (2013.01); B81B 7/0061 (2013.01); B81B 2201/0257 (2013.01); G01H 11/06 (2013.01); H04R 19/005 (2013.01); H04R 31/006 (2013.01); H04R 2201/003 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A device, comprising:
a substrate component, wherein an acoustic port is formed in a first portion of the substrate component;
a sensor component comprising a diaphragm component disposed over the acoustic port;
a handle component disposed between the diaphragm component and the substrate component, wherein the diaphragm component spans from a first handle portion of the handle component across the acoustic port to a second handle portion of the handle component, and wherein the diaphragm component is configured to contain no hole; and
a vent component that is associated with a vent port formed in a second portion of the device other than the diaphragm component, wherein the device comprises a back cavity that is partially formed and defined by the substrate component, the sensor component, and the vent component, wherein the vent port provides a vent path that facilitates an equalization of pressure associated with the diaphragm component, wherein the vent component comprises a Microelectromechanical Systems (MEMS) structure that is integrated with the vent port and associated with the vent path, wherein the vent path is an only vent path to the back cavity,
wherein the sensor component has a sensing directionality that is based on a group of characteristics of the vent component and the vent port, and wherein the group of characteristics comprise the MEMS structure that is integrated with the vent port.