US 12,012,575 B2
Composition for surface treatment, method for producing the same, surface treatment method, and method for producing semiconductor substrate
Keita Suzuki, Kiyosu (JP); and Yohei Takahashi, Kiyosu (JP)
Assigned to FUJIMI INCORPORATED, Kiyosu (JP)
Appl. No. 17/429,471
Filed by FUJIMI INCORPORATED, Kiyosu (JP)
PCT Filed Jan. 6, 2020, PCT No. PCT/JP2020/000058
§ 371(c)(1), (2) Date Aug. 9, 2021,
PCT Pub. No. WO2020/194978, PCT Pub. Date Oct. 1, 2020.
Claims priority of application No. 2019-058832 (JP), filed on Mar. 26, 2019.
Prior Publication US 2022/0089981 A1, Mar. 24, 2022
Int. Cl. C11D 7/02 (2006.01); C11D 7/26 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01)
CPC C11D 7/02 (2013.01) [C11D 7/261 (2013.01); H01L 21/02052 (2013.01); H01L 21/30625 (2013.01)] 13 Claims
 
1. A composition for surface treatment, wherein:
the composition comprises a solvent, a water-soluble polymer, and a dissolved gas;
the dissolved gas comprises clean air;
a concentration of the dissolved gas is 0.01 mg/L or more and 10 mg/L or less with respect to a total volume of the composition;
the composition has a pH of 7 or less; and
the composition is used for reducing residues on a surface of a chemically mechanically polished object.