	US 12,012,490 B2
	Composition and heat radiation sheet manufactured therefrom
Hyo Soon Park, Daejeon (KR); and Je Sik Jung, Daejeon (KR)
Assigned to LG Chem, Ltd., Seoul (KR)
Appl. No. 17/282,562
Filed by LG Chem, Ltd., Seoul (KR)
PCT Filed Jul. 9, 2020, PCT No. PCT/KR2020/008976 § 371(c)(1), (2) Date Apr. 2, 2021, PCT Pub. No. WO2021/006646, PCT Pub. Date Jan. 14, 2021.
Claims priority of application No. 10-2019-0082964 (KR), filed on Jul. 10, 2019.
Prior Publication US 2021/0340342 A1, Nov. 4, 2021
Int. Cl. C08J 5/18 (2006.01); C08F 20/18 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08K 5/11 (2006.01)

CPC C08J 5/18 (2013.01) [C08F 20/18 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 5/11 (2013.01); C08J 2333/08 (2013.01); C08K 2003/2227 (2013.01)]

11 Claims

1. A composition comprising:

a thermally conductive filler;

a plasticizer; acrylic acid; and

an alkyl (meth)acrylate monomer,

wherein the acrylic acid is contained in an amount of 0.3 parts by weight to 0.5 parts by weight, based on 100 parts by weight of the alkyl (meth)acrylate monomer;

wherein the plasticizer is one or more of triethylhexyl trimellitate, triisononyl trimellitate, or diisononyl adipate, and

wherein the plasticizer is contained in an amount of 30 parts by weight to 80 parts by weight, based on 100 parts by weight of the alkyl (meth)acrylate monomer.