US 12,012,328 B2
Stress isolated device package and method of manufacture
Chad Dawson, Queen Creek, AZ (US); Mark Edward Schlarmann, Chandler, AZ (US); Stephen Ryan Hooper, Mesa, AZ (US); and Colin Bryant Stevens, Austin, TX (US)
Assigned to NXP USA, Inc., Austin, TX (US)
Filed by NXP USA, Inc., Austin, TX (US)
Filed on May 3, 2021, as Appl. No. 17/246,986.
Prior Publication US 2022/0348456 A1, Nov. 3, 2022
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01)
CPC B81B 7/0058 (2013.01) [B81C 1/00325 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/07 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A package comprising:
a die that includes a substrate having a first surface and a second surface, a sensor formed at a sensor region of the first surface, and a hollow trench extending entirely through the substrate between the first and second surfaces, the trench having at vertical opening at least partially surrounding the sensor region at the first surface that separates the sensor region from a remaining portion of the first surface surrounding the sensor region;
an isolation material formed on the first surface and extending over the vertical opening of the trench between the sensor region and the remaining portion of the first surface; and
a ring structure coupled to the remaining portion of first surface of the substrate to create a first cavity in which the sensor is contained, the ring structure being laterally displaced away from and surrounding the sensor region and the trench above the remaining portion of the first surface;
wherein the package further comprises a gel material disposed in the first cavity that covers the sensor and is prevented from entering the trench by the isolation material.