US 12,011,934 B2
Substrate processing apparatus and the method thereof
Sung Ho Kim, Chungcheongnam-do (KR); Yoon Ok Jang, Chungcheongnam-do (KR); Bo Yeon Hwang, Chungcheongnam-do (KR); Hyun Min Lee, Chungcheongnam-do (KR); and Kwang Jun Choi, Chungcheongnam-do (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Jul. 22, 2022, as Appl. No. 17/870,840.
Claims priority of application No. 10-2021-0111471 (KR), filed on Aug. 24, 2021.
Prior Publication US 2023/0068295 A1, Mar. 2, 2023
Int. Cl. B41J 2/205 (2006.01); B41J 2/21 (2006.01)
CPC B41J 2/2054 (2013.01) [B41J 2/2132 (2013.01); B41J 2/2142 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A method of processing a substrate, comprising:
forming on the substrate a plurality of ink patterns spaced apart from each other by jetting ink onto the substrate by using a plurality of nozzles;
calculating a density of each of the plurality of ink patterns; and
selecting at least one nozzle for jetting ink into one pixel area based on respectively calculated densities of the plurality of ink patterns.