CPC B29C 73/04 (2013.01) [B29C 65/54 (2013.01); B29C 66/82661 (2013.01); B29C 73/24 (2013.01); B29L 2031/3076 (2013.01); B64F 5/40 (2017.01)] | 20 Claims |
1. A method of eliminating voids and manipulating a bond line, comprising:
applying an adhesive at a center of an area of a structure;
placing a doubler on the adhesive over the area of the structure, wherein the doubler has a doubler center and a peripheral edge that surrounds the doubler center;
maintaining a negative pressure at the peripheral edge of the doubler while simultaneously maintaining a positive pressure at the doubler to purge entrapped gases and control a thickness of the bond line at the peripheral edge of the doubler;
placing a first vacuum bag over the doubler; and
placing a plurality of edge rings around the peripheral edge of the doubler and over the first vacuum bag, wherein the plurality of edge rings includes a first edge ring and a second edge ring, and wherein the second edge ring is stacked on the first edge ring.
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