US 12,011,892 B2
Double vacuum and positive pressure for paste bond joints
John F. Spalding, Seattle, WA (US); and Mohamed Azdamou, Seattle, WA (US)
Assigned to The Boeing Company, Chicago, IL (US)
Filed by The Boeing Company, Chicago, IL (US)
Filed on Aug. 9, 2021, as Appl. No. 17/397,443.
Prior Publication US 2023/0045535 A1, Feb. 9, 2023
Int. Cl. B29C 73/04 (2006.01); B29C 65/00 (2006.01); B29C 65/54 (2006.01); B29C 73/24 (2006.01); B29L 31/30 (2006.01); B64F 5/40 (2017.01)
CPC B29C 73/04 (2013.01) [B29C 65/54 (2013.01); B29C 66/82661 (2013.01); B29C 73/24 (2013.01); B29L 2031/3076 (2013.01); B64F 5/40 (2017.01)] 20 Claims
OG exemplary drawing
 
1. A method of eliminating voids and manipulating a bond line, comprising:
applying an adhesive at a center of an area of a structure;
placing a doubler on the adhesive over the area of the structure, wherein the doubler has a doubler center and a peripheral edge that surrounds the doubler center;
maintaining a negative pressure at the peripheral edge of the doubler while simultaneously maintaining a positive pressure at the doubler to purge entrapped gases and control a thickness of the bond line at the peripheral edge of the doubler;
placing a first vacuum bag over the doubler; and
placing a plurality of edge rings around the peripheral edge of the doubler and over the first vacuum bag, wherein the plurality of edge rings includes a first edge ring and a second edge ring, and wherein the second edge ring is stacked on the first edge ring.