US 12,011,887 B2
Systems and methods for thermoplastic panel manufacturing
Shawn Tardy, Menifee, CA (US); Noushin Bahramshahi, Mission Viejo, CA (US); Andrew Adan, Corona, CA (US); Roberto Ramos, Moreno Valley, CA (US); and Nicole M. Sannes, Chula Viista, CA (US)
Assigned to ROHR, INC., Chula Vista, CA (US)
Filed by ROHR, INC., Chula Vista, CA (US)
Filed on Dec. 17, 2021, as Appl. No. 17/554,775.
Prior Publication US 2023/0191722 A1, Jun. 22, 2023
Int. Cl. B29C 70/44 (2006.01); B29C 65/00 (2006.01); B29C 70/54 (2006.01); B29L 7/00 (2006.01)
CPC B29C 70/443 (2013.01) [B29C 66/0044 (2013.01); B29C 66/7392 (2013.01); B29C 66/81455 (2013.01); B29C 66/91411 (2013.01); B29C 70/549 (2021.05); B29L 2007/002 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of manufacturing a thermoplastic panel, the method comprising:
tacking together a plurality of plies of material comprising thermoplastic resin and fiber to form a preform;
disposing a release agent on a layup surface of an invar mold, the release agent comprising a solvent-based moisture curing release epoxy; subsequently
laying up the preform on the release agent;
at least partially enclosing the preform within a breather frame;
laying up a caul plate, the preform disposed between the caul plate and the invar mold;
laying up a heated blanket of a hot bonder system on the caul plate;
laying up a breather on the heated blanket, the heated blanket disposed between the caul plate and the breather;
enclosing the preform within a vacuum bag and the invar mold to form a consolidation assembly, the vacuum bag and the invar mold fully enclosing the breather frame, the caul plate, the preform, and the heated blanket;
generating, via the hot bonder system, a vacuum environment between the invar mold and the vacuum bag; and
curing, via a curing step, the preform to form the thermoplastic panel, the curing step including:
heating, via the hot bonder system, the heated blanket to a first cure temperature, wherein the first cure temperature is between 500° F. (260° C.) and 600° F. (316° C.);
dwelling, via the hot bonder system, at the first cure temperature for a first time period, wherein the first dwell period is between 5 minutes and 60 minutes;
heating, via the hot bonder system, from the first cure temperature to a second cure temperature after the first time period, wherein the second cure temperature is between 600° F. (316° C.) and 800° F. (427° C.), wherein the second cure temperature is greater than the first cure temperature; and
dwelling, via the hot bonder system, at the second cure temperature for a second dwell period, wherein the second dwell period is between 5 minutes and 60 minutes.