US 12,011,854 B2
Fiber composites comprising a circuit, and method therefor
Ethan Escowitz, Berkeley, CA (US); Riley Reese, Oakland, CA (US); Andrew Mathews, Berkeley, CA (US); and J. Scott Perkins, Oakland, CA (US)
Assigned to Arris Composites Inc., Berkeley, CA (US)
Filed by Arris Composites Inc., Berkeley, CA (US)
Filed on Jan. 25, 2021, as Appl. No. 17/157,519.
Claims priority of provisional application 62/965,606, filed on Jan. 24, 2020.
Prior Publication US 2021/0229325 A1, Jul. 29, 2021
Int. Cl. B29C 43/18 (2006.01); B29K 79/00 (2006.01); B29L 31/34 (2006.01); H02J 7/00 (2006.01); H02J 7/02 (2016.01); H02J 50/00 (2016.01); H02J 50/10 (2016.01)
CPC B29C 43/18 (2013.01) [H02J 7/0042 (2013.01); H02J 7/02 (2013.01); H02J 50/005 (2020.01); H02J 50/10 (2016.02); B29C 2043/182 (2013.01); B29K 2079/08 (2013.01); B29L 2031/34 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for forming, via compression molding, a fiber-composite part that includes a circuit, the method comprising:
fabricating the circuit;
covering the circuit with a polyimide tape having a melting point that exceeds a maximum temperature to which the circuit is exposed during the compression-molding;
forming a lay-up of plies in a mold cavity, each ply comprising fibers and thermoplastic resin;
positioning the circuit in the lay-up of plies, ensuring that the circuit is positioned in a desired location in the fiber-composite part by:
(a) forming an opening in at least one ply of the lay-up thereof, wherein a position of the opening in the at least one ply corresponds to the desired location of the circuit in the fiber-composite part, the opening thereby registering the circuit to a desired position in the fiber-composite part being molded, and
(b) disposing the circuit in the opening; and
molding the fiber-composite part via the compression molding, wherein due to being positioned in the layup of plies, the circuit is disposed within the matrix of the fiber-composite part.