US 12,011,777 B2
Laser processing apparatus, laser processing method, and method for manufacturing semiconductor device
Yoshihiro Yamaguchi, Yokohama (JP); Miki Sawai, Yokohama (JP); Sadao Tanigawa, Yokohama (JP); Hirotaka Sazuka, Yokohama (JP); and Naoyuki Kobayashi, Yokohama (JP)
Assigned to JSW AKTINA SYSTEM CO., LTD, Yokohama (JP)
Appl. No. 16/768,681
Filed by JSW AKTINA SYSTEM CO., LTD., Yokohama (JP)
PCT Filed Oct. 30, 2018, PCT No. PCT/JP2018/040223
§ 371(c)(1), (2) Date May 31, 2020,
PCT Pub. No. WO2019/138659, PCT Pub. Date Jul. 18, 2019.
Claims priority of application No. 2018-002460 (JP), filed on Jan. 11, 2018.
Prior Publication US 2021/0187659 A1, Jun. 24, 2021
Int. Cl. B23K 26/03 (2006.01); B23K 26/50 (2014.01); B23K 101/40 (2006.01); H01L 21/268 (2006.01)
CPC B23K 26/032 (2013.01) [B23K 26/50 (2015.10); H01L 21/268 (2013.01); B23K 2101/40 (2018.08)] 14 Claims
OG exemplary drawing
 
1. A laser processing apparatus comprising:
a processing chamber configured to perform laser processing for an object to be processed;
a stage disposed inside the processing chamber, the stage being configured to convey the object to be processed; and
a control unit configured to instruct a loading/unloading apparatus about a placement position of the object to be processed over the stage, the loading/unloading apparatus being configured to load/unload the object to be processed into/from the processing chamber,
wherein
the processing chamber comprises a loading gate for loading the object to be processed and an unloading gate for unloading the object to be processed;
the object to be processed is conveyed only in a first direction from the loading gate toward the unloading gate over the stage;
the loading/unloading apparatus being configured to carry the object to be processed into the processing chamber through the loading gate, place the object to be processed over a first end of the stage, and remove the object from the processing chamber through the unloading gate at a second end of the stage after laser processing,
the loading/unloading apparatus being further configured to place the object to be processed over the first end of the stage at different positions based on position control signals received from the control unit, the different positions being positions along a second direction, the second direction intersecting the first direction,
wherein
the loading/unloading apparatus is configured to place the object to be processed at the first end of the stage at a first position based on a first position control signal from the control unit and unload the object from the processing chamber after the object has been first laser processed while conveyed along the first direction from the first position to the unloading gate, and
the loading/unloading apparatus is further configured to place the object to be processed at the first end of the stage at a second position based on a second position control signal from the control unit so as to be second laser processed while conveyed along the first direction from the second position to the unloading gate,
wherein the loading/unloading apparatus places the object at the second position based on the determination by the control unit that an irradiation area of the object has not been irradiated with laser light during the first laser processing of the object.