US 12,011,717 B2
Fluid handling device and fluid handling system
Seiichiro Suzuki, Saitama (JP); and Nobuya Sunaga, Saitama (JP)
Assigned to Enplas Corporation, Saitama (JP)
Filed by Enplas Corporation, Saitama (JP)
Filed on Sep. 30, 2021, as Appl. No. 17/490,141.
Prior Publication US 2023/0097798 A1, Mar. 30, 2023
Int. Cl. B01L 3/00 (2006.01); F04B 43/02 (2006.01)
CPC B01L 3/50273 (2013.01) [F04B 43/02 (2013.01); B01L 2300/08 (2013.01); B01L 2300/0887 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A fluid handling device comprising:
a substrate;
a circular first groove disposed on the substrate;
a second groove connected to the first groove by a first connecting portion;
a third groove connected to the first groove by a second connecting portion;
a film joined to the substrate so as to cover the first groove, the second groove and the third groove; and
a joining area in the first groove where the film and the bottom of the first groove are joined by welding or an adhesive, the joining area being disposed between the first connecting portion and the second connecting portion,
a non-joining area in the first groove where the film and the bottom of the first groove are not joined by welding or an adhesive,
wherein a surface of the film in the joining area is located closer to the bottom of the first groove than a surface of the film in the non-joining area, and
the first groove in the non-joining area functions as a rotary membrane pump.