US 12,011,605 B2
Filtered feedthrough assembly for use in implantable medical device and method of manufacturing the same
Haytham M. Hussein, Greer, SC (US)
Assigned to Pacesetter, Inc., Sylmar, CA (US)
Filed by Pacesetter, Inc., Sylmar, CA (US)
Filed on Dec. 21, 2022, as Appl. No. 18/085,602.
Application 18/085,602 is a continuation of application No. 16/675,834, filed on Nov. 6, 2019, granted, now 11,648,408.
Claims priority of provisional application 62/757,075, filed on Nov. 7, 2018.
Prior Publication US 2023/0118734 A1, Apr. 20, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. A61N 1/375 (2006.01); A61N 1/37 (2006.01); H01G 4/35 (2006.01)
CPC A61N 1/3754 (2013.01) [A61N 1/3718 (2013.01); A61N 1/37512 (2017.08); H01G 4/35 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a filtered feedthrough assembly for use with an implantable medical device, the method comprising:
securing an insulator to an inner surface of a feedthrough port of a flange at a first joint;
securing a plurality of feedthrough wires to the insulator at second joints, the second joints spaced apart from and surrounded by the first joint;
applying a non-conductive epoxy to cover the first joint and to separately cover each of the second joints;
applying a non-conductive washer on a face of the insulator;
applying an electrically conductive epoxy on a can side face of the flange; and
subsequent to applying the electrically conductive epoxy on the can side face, attaching an EMI filter to the flange via the electrically conductive epoxy so that the electrically conductive epoxy is compressed between the can side face of the flange and an opposing surface of the EMI filter to ground the EMI filter to the flange.