| CPC H10K 50/115 (2023.02) [H10K 50/15 (2023.02); H10K 50/16 (2023.02); H10K 2102/00 (2023.02)] | 18 Claims |

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1. An electrode structure for being integrated in an electronic component, comprising:
a seed layer, being connected to a functional material layer in the electronic component;
an electrode layer, being formed on the seed layer, and comprising a main film made of Ag and a dopant enclosed in the main film; and
a capping layer, being formed on the electrode layer;
wherein the dopant is Cu, and an amount of the dopant being in a range between 0.1% and 20%.
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