US 12,336,357 B2
Alignment-free micro-display architecture
Wei Sin Tan, Plymouth (GB); Andrea Pinos, Plymouth (GB); Samir Mezouari, Swindon (GB); and John Lyle Whiteman, St. Austell (GB)
Assigned to Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed by Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed on Nov. 24, 2021, as Appl. No. 17/534,806.
Prior Publication US 2023/0163156 A1, May 25, 2023
Int. Cl. H01L 27/15 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 33/24 (2010.01); H01L 33/42 (2010.01); H01L 33/46 (2010.01); H01L 33/62 (2010.01); H10H 20/01 (2025.01); H10H 20/821 (2025.01); H10H 20/833 (2025.01); H10H 20/841 (2025.01); H10H 20/857 (2025.01); H10H 29/14 (2025.01)
CPC H10H 29/142 (2025.01) [H01L 24/08 (2013.01); H01L 24/80 (2013.01); H10H 20/01 (2025.01); H10H 20/821 (2025.01); H10H 20/833 (2025.01); H10H 20/841 (2025.01); H10H 20/857 (2025.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1426 (2013.01); H10H 20/032 (2025.01); H10H 20/034 (2025.01); H10H 20/0364 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A light source of a display system, the light source comprising:
a backplane wafer including a first bonding layer, the first bonding layer including an array of pixel contact pads in a first dielectric layer;
a second bonding layer including an array of metal contact pads in a second dielectric layer, wherein the second dielectric layer is bonded to the first dielectric layer; and
an array of mesa structures on the second bonding layer, each mesa structure of the array of mesa structures comprising:
an n-type semiconductor layer;
a p-type semiconductor layer; and
an active region between the n-type semiconductor layer and the p-type semiconductor layer and configured to emit light,
wherein each pixel contact pad of the array of pixel contact pads is in contact with two or more metal contact pads of the array of metal contact pads in the second bonding layer, the two or more metal contact pads electrically coupled to a same mesa structure of the array of mesa structures, such that each pixel contact pad is electrically connected to a corresponding mesa structure of the array of mesa structures without a need to precisely align the first bonding layer and the second bonding layer when bonding the second bonding layer to the first bonding layer.