US 12,336,337 B2
Light-emitting element and light-emitting device
Hiroaki Kageyama, Tokushima (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Sep. 29, 2021, as Appl. No. 17/489,392.
Claims priority of application No. 2020-165837 (JP), filed on Sep. 30, 2020.
Prior Publication US 2022/0102587 A1, Mar. 31, 2022
Int. Cl. H10H 20/831 (2025.01); H10H 20/825 (2025.01); H10H 20/832 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01)
CPC H10H 20/8312 (2025.01) [H10H 20/84 (2025.01); H10H 20/857 (2025.01); H10H 20/825 (2025.01); H10H 20/835 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A light-emitting element comprising:
a semiconductor layered body including a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, the first semiconductor layer having a plurality of exposed portions exposed from the second semiconductor layer and the active layer at locations inward of an outer periphery of the second semiconductor layer in a plan view from a side of the second semiconductor layer;
an insulating film covering the semiconductor layered body and defining at least one first opening above one of the exposed portions and a plurality of second openings above a part of the second semiconductor layer;
a first electrode electrically connected to the first semiconductor layer through the first opening and partially located above the second semiconductor layer via the insulating film;
a second electrode electrically connected to the second semiconductor layer through the second openings and partially located above the second semiconductor layer via the insulating film;
a plurality of first bumps on the first electrode; and
a plurality of second bumps on the second electrode, the second bumps being aligned along a first direction, wherein
the first electrode has a first surface and the second electrode has a second surface above the insulating film disposed above the second semiconductor layer, the first surface and the second surface being located at a same height from the second semiconductor layer,
the first bumps are connected to the first surface, and the second bumps are connected to the second surface,
in the plan view, the second electrode has an elongated shape that is longer in the first direction than in a second direction perpendicular to the first direction,
in the plan view, each of the second openings has an elongated shape that is longer in the first direction and extends along an outer edge of the second electrode, with the second bumps being arranged between the second openings, and
in the plan view, the second bumps overlap the insulating film.