US 12,336,317 B2
Solid-state imaging device and electronic device including coupling structures for electrically interconnecting stacked semiconductor substrates
Hideto Hashiguchi, Kanagawa (JP); Reijiroh Shohji, Kanagawa (JP); Hiroshi Horikoshi, Kanagawa (JP); Ikue Mitsuhashi, Kanagawa (JP); Tadashi Iijima, Kanagawa (JP); Takatoshi Kameshima, Kanagawa (JP); Minoru Ishida, Kanagawa (JP); and Masaki Haneda, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Feb. 20, 2024, as Appl. No. 18/581,727.
Application 18/581,727 is a continuation of application No. 17/869,659, filed on Jul. 20, 2022, granted, now 11,948,961.
Application 17/869,659 is a continuation of application No. 16/497,497, granted, now 11,411,037, issued on Aug. 9, 2022, previously published as PCT/JP2018/011569, filed on Mar. 23, 2018.
Claims priority of application No. 2017-074806 (JP), filed on Apr. 4, 2017; and application No. 2017-156586 (JP), filed on Aug. 14, 2017.
Prior Publication US 2024/0194718 A1, Jun. 13, 2024
Int. Cl. H10F 39/00 (2025.01); H10F 39/12 (2025.01); H10F 39/18 (2025.01)
CPC H10F 39/811 (2025.01) [H10F 39/182 (2025.01); H10F 39/199 (2025.01); H10F 39/8023 (2025.01); H10F 39/8037 (2025.01); H10F 39/809 (2025.01)] 9 Claims
OG exemplary drawing
 
1. A light detecting device, comprising:
a first substrate that includes:
a first semiconductor substrate; and
a first multi-layered wiring layer on the first semiconductor substrate;
a second substrate that includes:
a second semiconductor substrate; and
a second multi-layered wiring layer on the second semiconductor substrate;
a third substrate that includes:
a third semiconductor substrate; and
a third multi-layered wiring layer on the third semiconductor substrate;
an electrode pad above the first multi-layered wiring layer;
an opening that passes through the second semiconductor substrate; and
an electrically conductive film arranged on a side wall of the opening, wherein
the first substrate, the second substrate, and the third substrate are stacked in this order,
the electrode pad and a wiring in the second multi-layered wiring layer are electrically connected via the electrically conductive film, and
the opening exposes the wiring in the second multi-layered wiring layer.