US 12,336,312 B2
Light receiving element and electronic apparatus
Yasuhisa Tochigi, Kanagawa (JP); Taiichiro Watanabe, Kanagawa (JP); and Fumihiko Koga, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 18/038,355
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Oct. 12, 2021, PCT No. PCT/JP2021/037642
§ 371(c)(1), (2) Date May 23, 2023,
PCT Pub. No. WO2022/118538, PCT Pub. Date Jun. 9, 2022.
Claims priority of application No. 2020-199408 (JP), filed on Dec. 1, 2020.
Prior Publication US 2023/0420482 A1, Dec. 28, 2023
Int. Cl. H04N 25/778 (2023.01); H04N 25/78 (2023.01); H10F 39/18 (2025.01); H10K 39/32 (2023.01)
CPC H10F 39/1843 (2025.01) [H04N 25/778 (2023.01); H04N 25/78 (2023.01); H10K 39/32 (2023.02)] 11 Claims
OG exemplary drawing
 
1. A light receiving element comprising a plurality of pixels,
each of the plurality of pixels including:
a photoelectric conversion layer that photoelectrically converts incident light;
a signal reading circuit including an in-pixel transistor that is provided on a side opposite to a light incident side surface of the photoelectric conversion layer, amplifies signal charge generated by the photoelectric conversion layer, and reads the signal charge out of a pixel array; and
a metal junction that bonds the photoelectric conversion layer and the signal reading circuit,
the metal junction covering the in-pixel transistor when viewed from the light incident side surface of the photoelectric conversion layer.