| CPC H10F 39/026 (2025.01) [H01L 23/544 (2013.01); H01L 24/08 (2013.01); H10F 39/182 (2025.01); H10F 39/8053 (2025.01); H10F 39/8063 (2025.01); H10F 39/809 (2025.01); H01L 2223/54426 (2013.01); H01L 2224/0224 (2013.01); H01L 2224/08145 (2013.01)] | 20 Claims |
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1. An image sensing device, comprising:
an upper substrate configured to include a pixel region and a first peripheral region located outside the pixel region, the pixel region including unit pixels configured to generate electrical signals through conversion of incident light;
a lower substrate configured to include a logic region and a second peripheral region located outside the logic region, the logic region coupled to receive the electrical signals from the unit pixels and configured to generate an image based on the electrical signals from the unit pixels;
light reception elements disposed over a first surface of the upper substrate, and configured to transmit the incident light to the pixel region;
an insulation layer disposed over a second surface located opposite to the first surface of the upper substrate and between the upper substrate and the lower substrate;
a light reception alignment mark disposed in the first peripheral region of the upper substrate and configured to assist positioning of the light reception elements formed over the first surface of the upper substrate in the pixel region; and
an alignment pattern disposed between the first peripheral region and the second peripheral region and in the insulation layer, the alignment pattern disposed to overlap with the light reception alignment mark disposed in the first peripheral region and configured to absorb light used to measure the light reception alignment mark, and
wherein the alignment pattern is disposed not to overlap with the pixel region.
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