US 12,336,208 B2
Middle voltage transistor and fabricating method of the same
Wei-Hsuan Chang, Tainan (TW); Hao-Ping Yan, Tainan (TW); Ming-Hua Tsai, Tainan (TW); and Chin-Chia Kuo, Tainan (TW)
Assigned to UNITED MICROELECTRONICS CORP., Hsin-Chu (TW)
Filed by UNITED MICROELECTRONICS CORP., Hsin-Chu (TW)
Filed on Mar. 15, 2022, as Appl. No. 17/694,694.
Claims priority of application No. 202210132427.1 (CN), filed on Feb. 14, 2022.
Prior Publication US 2023/0261092 A1, Aug. 17, 2023
Int. Cl. H10D 30/01 (2025.01); H01L 21/266 (2006.01); H10D 30/60 (2025.01); H10D 62/10 (2025.01)
CPC H10D 30/0227 (2025.01) [H01L 21/266 (2013.01); H10D 30/601 (2025.01); H10D 62/102 (2025.01)] 7 Claims
OG exemplary drawing
 
1. A middle voltage transistor, comprising: a substrate; a gate disposed on the substrate; a gate dielectric layer disposed between the substrate and the gate and a width of the gate dielectric layer is greater than a width of the gate; a composite spacer contacting the gate and disposed at one side of the gate, wherein the composite spacer comprises: a first spacer contacting the gate and disposed at one side of the gate; and a second spacer contacting the first spacer, wherein the first spacer and the second spacer are entirely disposed at a top surface of the gate dielectric layer; a first lightly doping region embedded in the substrate and extending to be under the gate; a second lightly doping region embedded within the first lightly doping region, and the first lightly doping region surrounding the second lightly doping region, wherein the second lightly doping region comprises a first edge, and the first edge is disposed directly under the composite spacer; a source/drain doping region embedded within the second lightly doping region, and the second lightly doping region surrounding the source/drain doping region, wherein the source/drain doping region comprises a second edge; and a silicide layer covering and contacting the source/drain doping region, wherein the silicide layer comprises an end, and the end is disposed between the first edge and the second edge contacting the gate dielectric layer.