US 12,336,147 B2
Component cooler for a computing device
Christopher M. Helberg, Austin, TX (US); Christopher M. Jaggers, Austin, TX (US); Robert Edward Radke, Austin, TX (US); Mustansir M. Pratapgarhwala, Austin, TX (US); Michael J. Austin, Austin, TX (US); and Sukesh Shenoy, Austin, TX (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Sep. 29, 2022, as Appl. No. 17/956,799.
Prior Publication US 2024/0114658 A1, Apr. 4, 2024
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01L 23/38 (2006.01); H01L 23/427 (2006.01); H01L 23/473 (2006.01)
CPC H05K 7/20336 (2013.01) [G06F 1/20 (2013.01); H01L 23/427 (2013.01); H01L 23/473 (2013.01); H05K 7/20254 (2013.01); H05K 7/20327 (2013.01); G06F 2200/201 (2013.01); H01L 23/38 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An apparatus for component cooling, comprising:
a first heat transfer element configured to be thermally coupled to a heat-generating electronic component;
a second heat transfer element;
a plurality of heat pipes thermally coupled between the first heat transfer element and the second heat transfer element, wherein each of the heat pipes provides a separate heat conduction path from the first heat transfer element to the second heat transfer element via a first heat transfer fluid within a respective one of the heat pipes; and
a manifold including a first fluid passage providing a first portion of a second heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the second heat transfer fluid in thermal contact with the second heat transfer element.
 
11. An apparatus for component cooling, comprising:
a first heat transfer element configured to be thermally coupled to a heat-generating electronic component;
a second heat transfer element;
a plurality of heat pipes thermally coupled between the first heat transfer element and the second heat transfer element, wherein each of the heat pipes provides a separate heat conduction path from the first heat transfer element to the second heat transfer element via a heat transfer fluid within a respective one of the heat pipes;
a cooling block including a fluid inlet, a fluid outlet, and a fluid passage within the cooling block that allows a heat transfer fluid in thermal contact with the first heat transfer element to flow between the fluid inlet and the fluid outlet; and
a first thermoelectric cooling device positioned between the cooling block and the first heat transfer element, the first thermoelectric cooling device having a first side facing the first heat transfer element and a second side facing the cooling block, wherein the first side is configured to absorb heat from the first heat transfer element and the second side is configured to release the heat to the cooling block.