US 12,336,146 B2
Temperature equalization component and electronic device
Yongfu Sun, Shenzhen (CN); Jian Shi, Shanghai (CN); Zhi Yuan, Shanghai (CN); Linfang Jin, Dongguan (CN); and Jie Yang, Dongguan (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Apr. 29, 2022, as Appl. No. 17/732,684.
Application 17/732,684 is a continuation of application No. PCT/CN2020/092146, filed on May 25, 2020.
Claims priority of application No. 201911056497.8 (CN), filed on Oct. 31, 2019.
Prior Publication US 2022/0256740 A1, Aug. 11, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20336 (2013.01) 18 Claims
OG exemplary drawing
 
1. A temperature equalization component, comprising:
a housing, and a capillary structure, wherein the housing comprises a cavity, and the capillary structure is located in the cavity;
the housing is provided with a first protrusion part and/or a first depression part that are/is configured to be in contact with an element to which the temperature equalization component is applicable to decrease temperature of the element; and
the capillary structure is disposed on only a side of the housing that is closest to a side of the element among all the sides of the housing,
wherein the housing comprises a first cover plate and a second cover plate that are disposed opposite to each other, the first cover plate facing the element, and the second cover plate being away from the element;
the first cover plate comprises a body part, the first protrusion part and/or the first depression part are/is disposed on the first cover plate the first protrusion part protrudes from the body part, and/or the first depression part depresses relative to the body part; and
the capillary structure only covers the first cover plate including the body part, the first protrusion part and/or the first depression part while leaving the second cover plate uncovered by a capillary structure.