US 12,336,139 B2
Server device and cooling apparatus
Jiaqing Ji, Shanghai (CN); Jiang-Jun Wu, Shanghai (CN); and Ke Sun, Shanghai (CN)
Assigned to INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai (CN); and INVENTEC TECHNOLOGY CORPORATION, Taipei (TW)
Filed by INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai (CN); and INVENTEC CORPORATION, Taipei (TW)
Filed on Jun. 14, 2023, as Appl. No. 18/209,834.
Claims priority of application No. 202310655456.0 (CN), filed on Jun. 5, 2023.
Prior Publication US 2024/0407131 A1, Dec. 5, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20272 (2013.01) [H05K 7/20772 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A server device, comprising:
a casing, having an accommodating space, at least one liquid inlet and at least one liquid outlet, wherein the accommodating space is configured to accommodate a cooling liquid, and the accommodating space is in fluid communication with the at least one liquid inlet and the at least one liquid outlet;
at least one flow equalizing plate, detachably located in the accommodating space, wherein the at least one flow equalizing plate divides the accommodating space into an upper subspace and a lower subspace, the at least one flow equalizing plate has a plurality of through holes, the plurality of through holes are in fluid communication with the upper subspace and the lower subspace, the at least one liquid inlet is in fluid communication with the lower subspace, and the at least one liquid outlet is in fluid communication with the upper subspace; and
at least one server, located in the upper subspace, wherein the at least one liquid inlet and the at least one liquid outlet are in fluid communication with the at least one server;
wherein sizes of the plurality of through holes of the at least one flow equalizing plate are different.