US 12,336,135 B2
Computational heat dissipation structure, computing device comprising same, mine
Ning Zhang, Beijing (CN); and Nangeng Zhang, Beijing (CN)
Assigned to Canaan Creative Co., LTD., Beijing (CN)
Filed by Canaan Creative Co., LTD., Beijing (CN)
Filed on Dec. 18, 2023, as Appl. No. 18/544,346.
Application 18/544,346 is a continuation of application No. 18/301,380, filed on Apr. 17, 2023, granted, now 11,882,669.
Application 18/301,380 is a continuation of application No. 17/872,172, filed on Jul. 25, 2022, granted, now 11,895,802.
Application 17/872,172 is a continuation of application No. 16/614,054, granted, now 11,425,839, issued on Aug. 23, 2022, previously published as PCT/CN2018/083956, filed on Apr. 20, 2018.
Claims priority of application No. 201710353744.5 (CN), filed on May 18, 2017.
Prior Publication US 2024/0121910 A1, Apr. 11, 2024
Int. Cl. H05K 7/20 (2006.01); F04D 27/00 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20154 (2013.01) [F04D 27/004 (2013.01); G06F 1/206 (2013.01); H05K 7/20145 (2013.01); H05K 7/20518 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A circuit board, comprising:
a plurality of heat-generating components arranged in rows and columns, wherein the circuit board is placed in a cooling duct with an air inlet and an air outlet, a direction from the air inlet to the air outlet is a cooling direction, and
along the cooling direction, adjacent heat-generating components in a same row include form at least five different interval lengths.