US 12,336,113 B2
Method of printed circuit board dielectric molding or machining and electrolytic metallization
Edward C. Carignan, Round Rock, TX (US); and Paulo Guedes-Pinto, Round Rock, TX (US)
Assigned to INFINITUM ELECTRIC INC., Round Rock, TX (US)
Filed by INFINITUM ELECTRIC INC., Round Rock, TX (US)
Filed on Mar. 27, 2024, as Appl. No. 18/617,879.
Application 18/617,879 is a continuation in part of application No. 18/127,475, filed on Mar. 28, 2023, granted, now 12,004,306.
Prior Publication US 2024/0334612 A1, Oct. 3, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 3/10 (2006.01); C25D 5/02 (2006.01); C25D 5/56 (2006.01); C25D 7/00 (2006.01); H02K 15/02 (2025.01); H02K 15/08 (2006.01)
CPC H05K 3/10 (2013.01) [C25D 5/02 (2013.01); C25D 5/56 (2013.01); C25D 7/00 (2013.01); H02K 15/02 (2013.01); H02K 15/08 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method of manufacturing a printed circuit board (PCB) stator for an axial field rotary energy device, the method comprising:
forming a PCB panel as a tridimensional (3D) dielectric substrate comprising fiber-reinforced polymer with opposite sides;
forming each side with channels and pockets by molding the 3D dielectric substrate, and the channels and pockets define a layout for conductive traces and pads, respectively, of the PCB panel;
forming the channels and pockets in a same side of the 3D dielectric substrate at a uniform depth that is equal to or greater than 140 μm;
forming side walls of the channels and pockets of the 3D dielectric substrate at a draft angle in a range of about 5 degrees to about 15 degrees;
depositing by electrolytic metallization and forming the conductive traces and pads into the channels and pockets, respectively, of the 3D dielectric substrate; and
making the outer surfaces of the conductive traces and pads flush with respective sides of the 3D dielectric substrate.