US 12,336,112 B2
High aspect ratio vias filled with liquid metal fill
Christopher David Bohn, New Albany, IN (US); Mark Crain, New Albany, IN (US); Justin Roehm, New Albany, IN (US); Thomas Jacob Hammann, Arvada, CO (US); Nathan Robertson, New Albany, IN (US); Jeremy Brown, New Albany, IN (US); Christopher Pelkey, New Albany, IN (US); Adam Owens, New Albany, IN (US); Russell Payton, New Albany, IN (US); and Russell Frank, New Albany, IN (US)
Assigned to SAMTEC, INC., New Albany, IN (US)
Appl. No. 18/554,556
Filed by SAMTEC, INC., New Albany, IN (US)
PCT Filed Apr. 11, 2022, PCT No. PCT/US2022/024275
§ 371(c)(1), (2) Date Oct. 9, 2023,
PCT Pub. No. WO2022/217146, PCT Pub. Date Oct. 13, 2022.
Claims priority of provisional application 63/301,425, filed on Jan. 20, 2022.
Claims priority of provisional application 63/211,330, filed on Jun. 16, 2021.
Claims priority of provisional application 63/173,135, filed on Apr. 9, 2021.
Prior Publication US 2024/0196540 A1, Jun. 13, 2024
Int. Cl. H05K 3/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01)
CPC H05K 3/0094 (2013.01) [H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H05K 1/115 (2013.01); H05K 3/426 (2013.01); H05K 2203/128 (2013.01); Y10T 29/49993 (2015.01)] 18 Claims
OG exemplary drawing
 
1. A method of metallizing a monolithic substrate body, the method comprising the steps of:
physically contacting a metal with a first surface of the monolithic substrate body opposite a second surface of the monolithic substrate body, wherein the metal comprises gold or a gold alloy, and the monolithic substrate body comprises sapphire;
causing a quantity of the metal in a molten state to flow via capillary action from the first surface toward the second surface of the monolithic substrate body in a via that extends along a centerline from the first surface to the second surface, so as to define a contact angle between the metal in the molten state and a metallic wetting liner, wherein the contact angle is less than 90 degrees; and
solidifying the metal in the molten state in the via to produce a solidified metal that defines an electrically conductive path between the first surface and the second surface,
wherein the contact angle is measured at an intersection between the metallic wetting liner and a straight line that extends tangent to an outer surface of the metal in the molten state in the via without crossing over the centerline, and the straight line is oriented toward the first surface of the monolithic substrate body.