US 12,336,110 B2
Systems for dismantling of double-sided PCBA
Ho Wai Phyllis Leung, Ma Wan (HK); Fung Ling Yeung, Tuen Mun (HK); and Nok Him Chan, Sheung Shui (HK)
Assigned to Intelligent Memory Limited, Kwa Chung (HK)
Filed by Intelligent Memory Limited, Kwai Chung (HK)
Filed on Mar. 17, 2023, as Appl. No. 18/122,995.
Prior Publication US 2024/0314994 A1, Sep. 19, 2024
Int. Cl. H05K 13/04 (2006.01); H05K 1/02 (2006.01)
CPC H05K 13/0486 (2013.01) [H05K 1/0203 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10734 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A system for dismantling BGA chips for double-sided PCBA having a symmetrical arrangement of BGA chips on both of a first and a second side of the PCBA, the system comprising:
a fix stage, comprising:
a holder configured to hold the double-sided PCBA within the fix stage;
a hot air gun comprising a hot air source and muzzle tube, the muzzle tube having an end arranged to align with a defective BGA on a first side of the double-sided PCBA;
at least one heat resistant shield body cover movably disposed along a rail that enables the at least one heat resistant shield body cover to move over the first side and along a long axis of the double-sided PCBA, such that the at least one heat resistant shield body cover can be positioned over a first adjacent BGA chip that is adjacent to the defective BGA chip; and
a cooling stage comprising:
a cooling source;
a heat-dissipative tube fluidly coupled to the cooling source at a first end and aligned at a second end with the end of the muzzle tube such that the second end aligns with a first opposite BGA chip disposed on the second side of the PCBA and that is opposite from the defective BGA chip;
at least one heat-dissipative element disposed along the second side of the PCBA, the at least one heat-dissipative element aligned with at least one second opposite BGA chip disposed on the second side of the PCBA, the at least one second opposite BGA chip located adjacent to the first opposite BGA chip on the second side of the PCBA; and
a layer of heat-dissipative media disposed on a side of the at least one heat-dissipative element that faces the second side of the PCBA.