US 12,336,101 B2
Card substrate for carrying chip module and smart card thereof
Ngai Man Poon, Hong Kong (CN); Rong Zhang, Shanghai (CN); and Yiqi Zhang, Shanghai (CN)
Assigned to PARLEX (SHANGHAI) ELECTRONICS CO., LTD., Shanghai (CN)
Filed by PARLEX (SHANGHAI) ELECTRONICS CO., LTD., Shanghai (CN)
Filed on Mar. 30, 2023, as Appl. No. 18/128,230.
Application 18/128,230 is a continuation of application No. PCT/CN2021/118042, filed on Sep. 13, 2021.
Claims priority of application No. 202011064735.2 (CN), filed on Sep. 30, 2020.
Prior Publication US 2023/0240013 A1, Jul. 27, 2023
Int. Cl. H05K 1/18 (2006.01)
CPC H05K 1/181 (2013.01) [H05K 2201/09036 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A card substrate for carrying a chip module, the card substrate comprising a first surface and a second surface opposite to the first surface, and a concave portion recessed from the first surface toward the second surface for accommodating the chip module, the concave portion comprising a first concave portion recessed from the first surface toward the second surface, and a second concave portion further recessed from a bottom wall of the first concave portion toward the second surface, characterized in that, the second concave portion accommodates and supports a chip of the chip module, in a left-right direction, a size of the second concave portion narrows from a middle to both sides, and in an up-down direction, a size of the second concave portion narrows from the middle to both sides, a first angle formed by a connecting line between a right end point and a upper end point of an outline of the second concave portion, and a connecting line between the right end point and a lower end point of the outline of the second concave portion is between 50 degrees and 80 degrees, a second angle formed by a connecting line between a left end point and the upper end point of the outline of the second concave portion, and a connecting line between the left end point and the lower end point of the outline of the second concave portion is also between 50 degrees and 80 degrees.