US 12,336,095 B2
Wiring substrate and method for manufacturing wiring substrate
Toshiki Furutani, Ogaki (JP)
Assigned to IBIDEN CO., LTD., Ogaki (JP)
Filed by IBIDEN CO., LTD., Gifu (JP)
Filed on Nov. 25, 2022, as Appl. No. 18/058,784.
Claims priority of application No. 2021-192110 (JP), filed on Nov. 26, 2021.
Prior Publication US 2023/0171884 A1, Jun. 1, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0298 (2013.01) [H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09827 (2013.01); H05K 2203/107 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wiring substrate, comprising:
a first conductor layer comprising a plurality of wirings;
an interlayer insulating layer formed on the first conductor layer such that the interlayer insulating layer is covering the first conductor layer;
a wiring layer formed in the interlayer insulating layer and comprising a plurality of wirings;
a second conductor layer formed on the interlayer insulating layer and comprising a plurality of wirings; and
a via conductor formed in the interlayer insulating layer such that the via conductor is penetrating through the interlayer insulating layer and connecting the first conductor layer and the second conductor layer,
wherein the interlayer insulating layer includes a first insulating layer and a second insulating layer laminated on the first insulating layer such that the wiring layer is formed on a surface of the first insulating layer on an opposite side with respect to the first conductor layer and that the via conductor is formed in a through hole penetrating through the first and second insulating layers in the interlayer insulating layer and connecting the first and second conductor layers, and the wiring layer is formed such that an aspect ratio of the wirings in the wiring layer is in a range of 2.0 to 6.0 and that an aspect ratio of the wirings in the first conductor layer and an aspect ratio of the wirings in the second conductor layer are in a range of 1.0 to 2.0.