US 12,336,089 B2
Radio frequency module and communication device
Yuji Takematsu, Kyoto (JP); Takanori Uejima, Kyoto (JP); and Dai Nakagawa, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on May 2, 2023, as Appl. No. 18/310,639.
Application 18/310,639 is a continuation of application No. PCT/JP2021/036907, filed on Oct. 6, 2021.
Claims priority of application No. 2020-202659 (JP), filed on Dec. 7, 2020.
Prior Publication US 2023/0269864 A1, Aug. 24, 2023
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0243 (2013.01) [H05K 2201/1006 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10507 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A radio frequency module comprising:
a module substrate having a main surface;
a first circuit component on the main surface;
a resin on the main surface and covering a side surface of the first circuit component;
a metal layer in contact with a top surface of the resin and a top surface of the first circuit component; and
an engraved portion on a top surface of the resin,
wherein the engraved portion does not overlap the first circuit component in a plan view of the module substrate.