US 12,336,087 B2
Electronic device comprising printed circuit board
Haekeu Park, Suwon-si (KR); Hyeonyeong Jeong, Suwon-si (KR); and Sunghoon Cho, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 22, 2022, as Appl. No. 17/871,266.
Application 17/871,266 is a continuation of application No. PCT/KR2021/000683, filed on Jan. 18, 2021.
Claims priority of application No. 10-2020-0013976 (KR), filed on Feb. 5, 2020.
Prior Publication US 2022/0361319 A1, Nov. 10, 2022
Int. Cl. H05K 1/02 (2006.01); H04R 1/08 (2006.01); H04R 1/10 (2006.01); H04R 3/00 (2006.01)
CPC H05K 1/0218 (2013.01) [H04R 1/08 (2013.01); H04R 1/1016 (2013.01); H04R 1/1041 (2013.01); H04R 1/1075 (2013.01); H04R 3/00 (2013.01); H04R 2420/07 (2013.01); H05K 2201/10098 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An electronic device comprising:
an antenna structure;
a microphone module spaced apart from the antenna structure; and
a printed circuit board on which the microphone module is disposed,
wherein the printed circuit board includes:
a first layer including a first microphone pad coupled to the microphone module, a first ground surrounding the first microphone pad, and a second microphone pad coupled to the microphone module and connected to the first ground; and
a second layer disposed under the first layer and including a second ground facing at least a portion of the first ground and the at least one first microphone pad,
wherein the first ground comprises:
a ground shield spaced apart from the first microphone pad;
a first ground wire connecting the ground shield and the second microphone pad; and
a second ground wire extending around the first microphone pad and connecting the first ground wire and the ground shield,
wherein the ground shield, the first ground wire, and the second ground wire surround the first microphone pad.