US 12,335,677 B2
Headset with improved headband and method for manufacturing the headset
Samer Richard Neergaard, Boston, MA (US); and Ronald W. Roberts, Melrose, MA (US)
Assigned to SONOS, INC., Goleta, CA (US)
Filed by Sonos, Inc., Santa Barbara, CA (US)
Filed on Apr. 5, 2024, as Appl. No. 18/627,867.
Application 18/627,867 is a continuation of application No. 17/686,746, filed on Mar. 4, 2022, granted, now 11,962,964.
Claims priority of provisional application 63/157,989, filed on Mar. 8, 2021.
Prior Publication US 2024/0323583 A1, Sep. 26, 2024
Int. Cl. H04R 1/10 (2006.01)
CPC H04R 1/105 (2013.01) [H04R 1/1008 (2013.01); H04R 1/1041 (2013.01); H04R 1/1066 (2013.01); H04R 2420/07 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A headset comprising:
a first earcup and a second earcup; and
a headband, wherein the headband comprises:
a connecting member having a first end coupled to the first earcup and a second end coupled to the second earcup;
a cushion disposed below the connecting member, wherein the cushion extends between the first end and the second end and comprises a middle region configured to have a first density and adjacent side regions configured to have a second density that is higher than the first density; and
wherein the cushion comprises:
a first side region positioned adjacent to the first end,
a second side region positioned adjacent to the second end, and
the middle region being disposed along the headband between the first side region and the second side region.