US 12,335,591 B2
Camera module substrate designs
Angelo M. Alaimo, San Jose, CA (US); Wassim Ferose Habeeb Rakuman, Sammamish, WA (US); Bohan Hao, Santa Clara, CA (US); and Ya-Wen Hsu, San Francisco, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Jan. 26, 2023, as Appl. No. 18/101,950.
Claims priority of provisional application 63/409,595, filed on Sep. 23, 2022.
Prior Publication US 2024/0107148 A1, Mar. 28, 2024
Int. Cl. H04N 23/57 (2023.01); G03B 30/00 (2021.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01)
CPC H04N 23/57 (2023.01) [G03B 30/00 (2021.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01)] 19 Claims
OG exemplary drawing
 
1. A camera module comprising:
a set of housing elements that at least partially defines an interior cavity;
a set of lens elements;
an image sensor; and
a substrate assembly comprising:
a set of rigid substrates;
a first set of electrical contacts positioned on a first surface of the set of rigid substrates; and
a second set of electrical contacts positioned on a second surface of the set of rigid substrates; wherein:
the substrate assembly at least partially defines an aperture;
the image sensor is positioned within the interior cavity to receive light through the set of lens elements and the aperture;
the substrate assembly is positioned such that a first portion of the substrate assembly is positioned inside the interior cavity and a second portion of the substrate assembly extends outside of the interior cavity;
the image sensor is connected to the first set of electrical contacts within the interior cavity; and
the second set of electrical contacts is positioned outside of the interior cavity.