US 12,334,969 B2
Radio-frequency module and communication device
Takanori Uejima, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Feb. 10, 2023, as Appl. No. 18/167,284.
Application 18/167,284 is a continuation of application No. PCT/JP2021/019674, filed on May 24, 2021.
Claims priority of application No. 2020-143730 (JP), filed on Aug. 27, 2020.
Prior Publication US 2023/0188171 A1, Jun. 15, 2023
Int. Cl. H04B 1/38 (2015.01); H03F 3/24 (2006.01); H04B 1/00 (2006.01); H04B 1/04 (2006.01)
CPC H04B 1/38 (2013.01) [H03F 3/245 (2013.01); H03F 2200/171 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A radio-frequency module comprising:
a module substrate having a first major surface;
a first power amplifier on the first major surface;
a second power amplifier on the first major surface;
a third power amplifier on the first major surface;
a first filter coupled to an output terminal of the first power amplifier, the first filter being configured to pass a transmit signal in a first communication band;
a second filter coupled to an output terminal of the second power amplifier, the second filter being configured to pass a transmit signal in a second communication band that is different from the first communication band;
a third filter coupled to an output terminal of the third power amplifier, the third filter being configured to pass a transmit signal in a third communication band that is different from the first communication band and the second communication band;
resin covering at least a portion of the first major surface;
a metal shield layer covering a surface of the resin, the metal shield layer being at a ground potential;
a first metal shield plate on the first major surface between the first power amplifier and the second power amplifier, as seen in a plan view of the module substrate; and
a second metal shield plate on the first major surface between the first power amplifier and the third power amplifier, as seen in the plan view,
wherein the first metal shield plate is in contact with a first ground electrode at the first major surface, and is in contact with the metal shield layer, and
wherein the second metal shield plate is in contact with a second ground electrode at the first major surface, and is in contact with the metal shield layer.