US 12,334,961 B2
Radio-frequency module
Hiromichi Kitajima, Kyoto (JP); Takanori Uejima, Kyoto (JP); Kunitoshi Hanaoka, Kyoto (JP); and Motoji Tsuda, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Jan. 13, 2023, as Appl. No. 18/154,225.
Application 18/154,225 is a continuation of application No. PCT/JP2021/028538, filed on Aug. 2, 2021.
Claims priority of application No. 2020-136566 (JP), filed on Aug. 13, 2020.
Prior Publication US 2023/0145698 A1, May 11, 2023
Int. Cl. H04B 1/00 (2006.01); H04B 1/04 (2006.01)
CPC H04B 1/0057 (2013.01) [H04B 1/0078 (2013.01); H04B 1/04 (2013.01); H04B 2001/0408 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio-frequency module comprising:
a first power amplifier;
a second power amplifier;
a first low noise amplifier;
a first filter that has a passband comprising frequencies of a first communication band, and that is connected to the first power amplifier and to the first low noise amplifier, the first communication band being included in a first communication band group;
a second filter that has a passband comprising frequencies of a second communication band, and that is connected to the second power amplifier, the second communication band being included in a second communication band group that is lower in frequency than the first communication band group; and
a module substrate having the first power amplifier, the second power amplifier, the first low noise amplifier, the first filter, and the second filter arranged thereon,
wherein, in a plan view of the module substrate, a distance between the first power amplifier and the first low noise amplifier is longer than a distance between the second power amplifier and the first low noise amplifier.