| CPC H03K 19/0027 (2013.01) [H01L 28/56 (2013.01); H01L 28/60 (2013.01)] | 20 Claims |

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1. An apparatus comprising:
a via extending along a y-plane, wherein the y-plane is orthogonal to an x-plane, wherein the via couples to a first metal layer;
a first capacitor including a linear dielectric material, wherein the first capacitor includes an electrode coupled to the via, and wherein the electrode is in a middle of the first capacitor;
a second capacitor including a linear dielectric material, wherein the electrode passes through a middle of the second capacitor;
a first input line extending along the x-plane or a z-plane, wherein the z-plane is orthogonal to the x-plane and the y-plane, and wherein the first input line is on an outer portion of the first capacitor;
a second input line extending along the x-plane or the z-plane, wherein the second input line is on an output portion of the second capacitor; and
a first transistor coupled to the via and a supply rail.
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