US 12,334,909 B2
Multi-level stacked acoustic wave (AW) filter packages and related fabrication methods
Manuel Hofer, Graz (AT); Xavier Perois, Mouans Sartoux (FR); Michael Wick, Munich (DE); Jeroen Bielen, Molenhoek (NL); Stefan Leopold Hatzl, Kloech (AT); and Juergen Portmann, Munich (DE)
Assigned to RF360 Singapore Pte. Ltd., Singapore (SG)
Filed by RF360 Singapore Pte. Ltd., Singapore (SG)
Filed on Sep. 22, 2021, as Appl. No. 17/481,811.
Prior Publication US 2023/0090842 A1, Mar. 23, 2023
Int. Cl. H03H 9/145 (2006.01); H03H 3/08 (2006.01); H03H 9/10 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01)
CPC H03H 9/64 (2013.01) [H03H 3/08 (2013.01); H03H 9/105 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01)] 33 Claims
OG exemplary drawing
 
1. A stacked acoustic wave (AW) filter package, comprising:
a first substrate comprising a first surface;
an AW filter circuit on the first surface of the first substrate;
a frame disposed on the first surface of the first substrate;
a second substrate comprising a contact surface and a side wall surface, the second substrate disposed on the frame to form a cavity between the AW filter circuit and the second substrate; and
a metallization layer comprising at least one metal interconnect coupled to the contact surface of the second substrate and the first surface of the first substrate, the at least one metal interconnect disposed on the side wall surface of the second substrate;
wherein the frame further comprises a perimeter frame disposed along a perimeter of the second substrate, and a frame member extending into the cavity, orthogonal to at least a portion of the perimeter frame, and
wherein the cavity is surrounded by the perimeter frame.