CPC H03H 9/64 (2013.01) [H03H 3/08 (2013.01); H03H 9/105 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01)] | 33 Claims |
1. A stacked acoustic wave (AW) filter package, comprising:
a first substrate comprising a first surface;
an AW filter circuit on the first surface of the first substrate;
a frame disposed on the first surface of the first substrate;
a second substrate comprising a contact surface and a side wall surface, the second substrate disposed on the frame to form a cavity between the AW filter circuit and the second substrate; and
a metallization layer comprising at least one metal interconnect coupled to the contact surface of the second substrate and the first surface of the first substrate, the at least one metal interconnect disposed on the side wall surface of the second substrate;
wherein the frame further comprises a perimeter frame disposed along a perimeter of the second substrate, and a frame member extending into the cavity, orthogonal to at least a portion of the perimeter frame, and
wherein the cavity is surrounded by the perimeter frame.
|