US 12,334,899 B2
Acoustic wave devices on stacked die
Hiroyuki Nakamura, Osaka-Fu (JP); Rei Goto, Osaka (JP); and Keiichi Maki, Suita (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Feb. 24, 2023, as Appl. No. 18/174,068.
Application 18/174,068 is a continuation of application No. 16/381,576, filed on Apr. 11, 2019, granted, now 11,616,487.
Claims priority of provisional application 62/659,568, filed on Apr. 18, 2018.
Prior Publication US 2023/0283255 A1, Sep. 7, 2023
Int. Cl. H03H 9/02 (2006.01); H03F 3/24 (2006.01); H03H 9/05 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01); H03H 9/46 (2006.01); H03H 9/54 (2006.01); H03H 9/64 (2006.01); H04B 1/00 (2006.01)
CPC H03H 9/0222 (2013.01) [H03F 3/24 (2013.01); H03H 9/02559 (2013.01); H03H 9/02574 (2013.01); H03H 9/02834 (2013.01); H03H 9/02866 (2013.01); H03H 9/058 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); H03H 9/465 (2013.01); H03H 9/54 (2013.01); H03H 9/64 (2013.01); H03H 9/6489 (2013.01); H04B 1/0057 (2013.01); H03F 2200/451 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A boundary acoustic wave device configured to generate a boundary acoustic wave having a wavelength of A, the boundary acoustic wave device comprising:
a piezoelectric layer;
an interdigital transducer electrode on the piezoelectric layer;
high acoustic velocity layers on opposing sides of the piezoelectric layer, the high acoustic velocity layers including a first high acoustic velocity layer and a second high acoustic velocity layer, the first high acoustic velocity layer having a thickness of at least 10λ; and
a low acoustic velocity layer positioned between the piezoelectric layer and one of the high acoustic velocity layers, the low acoustic velocity layer having a lower acoustic velocity than the high acoustic velocity layers.