US 12,334,883 B2
Power amplifier output matching
Yang Liu, Irvine, CA (US); Yong Hee Lee, Tustin, CA (US); Thomas Obkircher, Santa Ana, CA (US); and William J. Domino, Yorba Linda, CA (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Oct. 6, 2023, as Appl. No. 18/377,464.
Application 18/377,464 is a continuation of application No. 17/137,031, filed on Dec. 29, 2020, granted, now 11,817,832.
Claims priority of provisional application 62/957,074, filed on Jan. 3, 2020.
Prior Publication US 2024/0154586 A1, May 9, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H03F 3/191 (2006.01); H03F 1/56 (2006.01); H03F 3/213 (2006.01); H04B 1/3827 (2015.01); H04B 1/40 (2015.01)
CPC H03F 3/213 (2013.01) [H03F 1/565 (2013.01); H04B 1/3827 (2013.01); H04B 1/40 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A power amplifier system comprising:
a semiconductor-on-insulator die;
a power amplifier implemented on the semiconductor-on-insulator die and configured to amplify a radio frequency input signal having a fundamental frequency, the power amplifier; and
an output matching circuit including a first second-order harmonic rejection short circuit coupled between an output of the power amplifier and ground, a third-order harmonic rejection open circuit coupled between the output of the power amplifier and a first node, a second-order harmonic rejection open circuit coupled between the output of the power amplifier and the first node, and a second second-order harmonic rejection short circuit positioned between the first node and ground.