US 12,334,839 B2
Power converter having diode bridges in parallel with interconnect switching module
Rajkumar Sengodan, Bangalore (IN); and Saravanan Munusamy, Chengalpattu (IN)
Assigned to Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed by Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed on Mar. 3, 2023, as Appl. No. 18/117,192.
Claims priority of application No. 202241011985 (IN), filed on Mar. 5, 2022.
Prior Publication US 2023/0283201 A1, Sep. 7, 2023
Int. Cl. H02M 7/5387 (2007.01); H02M 7/487 (2007.01)
CPC H02M 7/5387 (2013.01) [H02M 7/487 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a DC voltage input configured to receive a DC voltage; and
a converter electrically coupled to the DC voltage input and configured to be electrically coupled to a load, the converter configured to convert the DC voltage from the DC voltage input to an AC voltage, the converter including:
a first inverter stage electrically coupled between the DC voltage input and a first diode bridge, wherein the first diode bridge comprises multiple first diodes;
a second inverter stage configured to be electrically coupled between the first diode bridge and the load, wherein the second inverter stage includes a second diode bridge, and wherein the second diode bridge comprises multiple second diodes; and
an interconnect switching module electrically coupled to the first and second diode bridges and configured to control an output level of the converter to the load, wherein the interconnect switching module comprises multiple switches;
wherein the multiple switches of the interconnect switching module are coupled in series with each other between positive and negative lines of the DC voltage input, the first diodes of the first diode bridge are coupled in series with each other between the positive and negative lines of the DC voltage input, and the second diodes of the second diode bridge are coupled in series with each other between the positive and negative lines of the DC voltage input; and
wherein the first diode bridge is coupled in parallel across the interconnect switching module and the second diode bridge is coupled in parallel across the interconnect switching module.