US 12,334,754 B2
Wireless power transmission apparatus
Kyunghwan Kim, Seoul (KR); Seonghun Lee, Seoul (KR); Taewook Kwon, Seoul (KR); Hyoungseok Kim, Seoul (KR); and Hongkwon Kim, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Appl. No. 18/016,585
Filed by LG ELECTRONICS INC., Seoul (KR)
PCT Filed Jul. 17, 2020, PCT No. PCT/KR2020/009486
§ 371(c)(1), (2) Date Jan. 17, 2023,
PCT Pub. No. WO2022/014758, PCT Pub. Date Jan. 20, 2022.
Prior Publication US 2023/0283119 A1, Sep. 7, 2023
Int. Cl. H02J 50/70 (2016.01); H01F 27/36 (2006.01); H02J 50/12 (2016.01)
CPC H02J 50/70 (2016.02) [H01F 27/36 (2013.01); H02J 50/12 (2016.02)] 14 Claims
OG exemplary drawing
 
1. A wireless power transmission apparatus, comprising:
a shielding plate;
a transmission coil on the shielding plate; and
a shielding member disposed on the shielding plate and configured to surround the transmission coil,
wherein the shielding member includes:
a base substrate including an opening;
a shielding layer disposed on the base substrate and configured to surround the transmission coil; and
a resonance capacitor mounted on the base substrate and connected to the shielding layer,
wherein the shielding layer includes two or more layers of pattern coils vertically overlapped,
wherein the base substrate includes vias, and
wherein the base substrate is disposed between three or more layers of pattern coils.