| CPC H01S 5/04256 (2019.08) [H01S 5/02315 (2021.01); H01S 5/4031 (2013.01)] | 8 Claims |

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1. A semiconductor laser light source module comprising:
an emission unit provided with an upper electrode and a lower electrode, emitting a laser light in one direction;
an end face emitting laser diode having a plurality of emission units arranged in a state where emission directions of the laser light are aligned;
a plurality of package side electrodes that supply current to respective emission units; and
a plurality of first wires that electrically and individually connect respective upper electrodes of the plurality of emission units with the package side electrodes corresponding to the upper electrodes,
wherein
one package side electrode corresponding to one emission unit in the arranged emission units is disposed in an opposite side of a portion where the laser light is emitted with respect to the one emission unit, one package side electrode corresponding to the other emission unit adjacent to the one emission unit is disposed in a direction side orthogonal to a direction along which the laser light is emitted with respect to the other emission unit,
whereby one first wire that connects the one emission unit with the one package side electrode corresponding to the one emission unit and the other first wire that connects the other emission unit with the one package side electrode corresponding to the other emission unit are non-parallel with each other in plan view,
the one first wire defining a first straight line that connects between a first emission-side connection point of the emission unit at which one first wire selected from the plurality of first wires is connected and a first package-side connection point of one package side electrode at which the selected one first wire is connected, and
the other first wire defining a second straight line that connects between a second emission-side connection point of the emission unit at which an adjacent first wire adjacent to the selected one first wire is connected and a second package-side connection point of one package side electrode at which the adjacent first wire is connected,
such that all angles formed between the first straight lines and the second straight lines in the semiconductor laser light source module are the same.
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