US 12,334,674 B2
DIMM retention assembly for compression mount technology and land grid array connector loading
Xiang Li, Portland, OR (US); George Vergis, Portland, OR (US); and Phil Geng, Washougal, WA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 9, 2021, as Appl. No. 17/470,646.
Prior Publication US 2021/0408724 A1, Dec. 30, 2021
Int. Cl. H01R 13/627 (2006.01); H05K 7/14 (2006.01); G06F 1/18 (2006.01); H01R 12/73 (2011.01)
CPC H01R 13/6272 (2013.01) [G06F 1/185 (2013.01); H01R 12/73 (2013.01); H01R 12/737 (2013.01); H05K 7/1409 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A computing system comprising:
a memory module;
a motherboard; and
a latch assembly coupled to the memory module and the motherboard, the latch assembly including:
a connector coupled to the motherboard,
a first lever coupled to the connector via a first pivot point,
an L-shaped load member extending through an opening in the first lever,
a second lever coupled to the L-shaped load member via a second pivot point, and
a spring to bias the L-shaped load member away from the opening in the first lever, wherein the spring is located so as to coil around a portion of the L-shaped load member.